XC3S700AN-5FGG484C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 484-BBGA |
| Number of Pins | 484 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 1999 |
| Series | Spartan®-3AN |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S700AN |
| Pin Count | 484 |
| Number of Outputs | 288 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Number of I/O | 372 |
| RAM Size | 45kB |
| Clock Frequency | 770MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 13248 |
| Total RAM Bits | 368640 |
| Number of Gates | 700000 |
| Number of LABs/CLBs | 1472 |
| Speed Grade | 5 |
| Combinatorial Delay of a CLB-Max | 0.62 ns |
| Height Seated (Max) | 2.6mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | ROHS3 Compliant |
XC3S700AN-5FGG484C Overview
There are two packages that contain fpga chips: 484-BBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 372 I/Os are programmed to ensure a more coherent data transfer. There are 13248 logic elements/cells to form a fundamental building block. It is powered from a supply voltage of 1.2V. An FPGA part from the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the Spartan?-3AN series is referred to as an FPGA. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. During the installation of this device, 288 outputs were incorporated. There is an FPGA model contained in Tray in order to conserve space. As a whole, it has 484 terminations. This device has 368640 RAM bits, which is the number of RAM bits that this device offers. If you are looking for related parts, you can use the base part number XC3S700AN as a starting point. For the program to work properly, the RAM si45kBe of this FPGA module must reach 45kB GB in order to ensure normal operation. In this case, 484 pins are used in the design. 1472 LABs/CLBs are configured on this FPGA. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga electronics operates from a 1.21.2/3.33.3V power supply. 700000 gates make up the basic block of its construction. A total of 484 pins are included in this device. It usually uses a 770MHz crystal.
XC3S700AN-5FGG484C Features
372 I/Os
Up to 368640 RAM bits
484 LABs/CLBs
XC3S700AN-5FGG484C Applications
There are a lot of Xilinx Inc. XC3S700AN-5FGG484C FPGAs applications.
- Embedded Vision
- Industrial,Medical and Scientific Instruments
- Medical imaging
- Scientific Instruments
- Automation
- Computer hardware emulation
- Space Applications
- Device controllers
- Electronic Warfare
- Enterprise networking
