XC3SD3400A-4FGG676C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 676-BGA |
| Number of Pins | 676 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | Spartan®-3A DSP |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3SD3400A |
| Pin Count | 676 |
| Number of Outputs | 409 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.22.5/3.3V |
| Number of I/O | 469 |
| RAM Size | 283.5kB |
| Clock Frequency | 250MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 53712 |
| Total RAM Bits | 2322432 |
| Number of Gates | 3400000 |
| Number of LABs/CLBs | 5968 |
| Speed Grade | 4 |
| Height Seated (Max) | 2.6mm |
| Length | 27mm |
| Width | 27mm |
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
XC3SD3400A-4FGG676C Overview
There is a 676-BGA package that includes this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. A total of 469 I/Os allow data to be transferred in a more coherent manner. To form a fundamental building block, there are 53712 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. A Field Programmable Gate Arrays-series FPGA part. Using a Surface Mount connector, you can mount this FPGA module on the development board. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. The FPGA belongs to the Spartan?-3A DSP series of FPGAs, and it is one type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 409 different outputs included. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The total number of terminations is 676. There are 2322432 RAM bits that are available with this device. Parts related to this part can be found using its base part number XC3SD3400A. During the configuration of this FPGA module, the RAM si283.5kBe reaches 283.5kB to ensure that the program runs normally. In this case, 676 pins are used in the design. This FPGA is built as an array of 5968 LABs/CLBs. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. A 1.2V-volt supply allows designers to fully utilize its flexibility. Power is provided by a 1.22.5/3.3V battery that is included with the device. Among its basic building blocks, there are 3400000 gates that are included in it. There are a total of 676 pins on this device. Fpga semiconductor typically uses a crystal oscillating at 250MHz.
XC3SD3400A-4FGG676C Features
469 I/Os
Up to 2322432 RAM bits
676 LABs/CLBs
XC3SD3400A-4FGG676C Applications
There are a lot of Xilinx Inc. XC3SD3400A-4FGG676C FPGAs applications.
- Automotive advanced driver assistance systems (ADAS)
- Distributed Monetary Systems
- Image processing
- Filtering and communication encoding
- Server Applications
- DO-254
- Automotive Applications
- Consumer Electronics
- Medical ultrasounds
- Audio
