XC3SD3400A-4FGG676I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 676-BGA |
| Number of Pins | 676 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | Spartan®-3A DSP |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3SD3400A |
| Pin Count | 676 |
| Number of Outputs | 409 |
| Qualification Status | Not Qualified |
| Power Supplies | 1.22.5/3.3V |
| Number of I/O | 469 |
| RAM Size | 283.5kB |
| Clock Frequency | 250MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 53712 |
| Total RAM Bits | 2322432 |
| Number of Gates | 3400000 |
| Number of LABs/CLBs | 5968 |
| Speed Grade | 4 |
| Height Seated (Max) | 2.6mm |
| Length | 27mm |
| Width | 27mm |
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
XC3SD3400A-4FGG676I Overview
In the 676-BGA package, you will find fpga chips. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 469 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 53712 logic elements/cells. It is powered from a supply voltage of 1.2V. A Field Programmable Gate Arrays-series FPGA part. Using a Surface Mount connector, you can mount this FPGA module on the development board. This device is powered by a 1.14V~1.26V battery. This is a type of FPGA that is part of the Spartan?-3A DSP series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. With this device, you will be able to make use of 409 outputs. Using the Tray layout, this FPGA model can be contained in a very small amount of space. In total, it has 676 terminations on each end. This device has 2322432 RAM bits, which is the number of RAM bits that this device offers. In order to find related parts, use the part number XC3SD3400A as a base. The RAM si283.5kBe of this FPGA module reaches 283.5kB so as to guarantee the normal operation of the program during operation. Fpga electronics is designed wfpga electronics h 676 pins. This FPGA is built as an array of 5968 LABs/CLBs. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. In order for fpga electronics to work, fpga electronics requires a 1.22.5/3.3V power supply. The building block that forms the basis of the system contains 3400000 gates. Featuring 676 pins in total, it is a versatile device. Normally, fpga semiconductor uses an oscillator, which oscillates at 250MHz, to create the signal.
XC3SD3400A-4FGG676I Features
469 I/Os
Up to 2322432 RAM bits
676 LABs/CLBs
XC3SD3400A-4FGG676I Applications
There are a lot of Xilinx Inc. XC3SD3400A-4FGG676I FPGAs applications.
- Industrial IoT
- Distributed Monetary Systems
- Automotive Applications
- Automotive advanced driver assistance systems (ADAS)
- OpenCL
- Industrial,Medical and Scientific Instruments
- Military Temperature
- Telecommunication
- Wired Communications
- Automotive
