Parameters |
Mounting Type |
Surface Mount |
Package / Case |
196-LBGA |
Supplier Device Package |
196-MAPBGA (15x15) |
Operating Temperature |
-40°C~100°C |
Packaging |
Tray |
Published |
2005 |
Series |
DSP563xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Type |
Fixed Point |
Base Part Number |
XC56L307 |
Interface |
Host Interface, SSI, SCI |
Voltage - I/O |
3.30V |
Non-Volatile Memory |
ROM (576B) |
Voltage - Core |
1.80V |
On Chip Data RAM |
576kB |
Clock Rate |
160MHz |
RoHS Status |
Non-RoHS Compliant |
XC56L307VF160 Overview
This is an electronic component with a 196-LBGA package.A packaging way of Tray is provided.As a member of Fixed Point, it is ideally suitable for a wide range of applications.In order to mount it, it must be in the direction of Surface Mount.It is important that the device is operated at a temperature of -40°C~100°C in order to ensure its normal functioning.As the name implies, the analog voltage range of 3.30V refers to the voltage that can be inserted or removed.It is a part of the DSP563xx series of digital signal processors.Based on its base part number of XC56L307, many ralated parts can be found.
XC56L307VF160 Features
Supplied in the 196-LBGA package
XC56L307VF160 Applications
There are a lot of NXP USA Inc. XC56L307VF160 DSP applications.
- Digital hardware
- Control systems
- Streaming videos
- Fourier transform
- Speech processing
- Other sensor array processing
- Speech processing and recognition
- Radar
- Sonar
- Smart phones