XC56L307VL150
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 196-LBGA |
| Supplier Device Package | 196-MAPBGA (15x15) |
| Operating Temperature | -40°C~100°C |
| Packaging | Tray |
| Published | 2005 |
| Series | DSP563xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | Fixed Point |
| Base Part Number | XC56L307 |
| Interface | Host Interface, SSI, SCI |
| Voltage - I/O | 3.30V |
| Non-Volatile Memory | ROM (576B) |
| Voltage - Core | 1.80V |
| On Chip Data RAM | 576kB |
| Clock Rate | 150MHz |
| RoHS Status | ROHS3 Compliant |
XC56L307VL150 Overview
It is a type of electronic component available in package 196-LBGA.A packaging way of Tray is provided.With its association with Fixed Point, it is suitable for a wide range of applications.It is mounted in the direction of Surface Mount as shown in the image below.By operating the device at the temperature of -40°C~100°C, a normal operation is ensured.The digital voltage range of 3.30V refers to the voltage that can be input or output.This digital signal processor is part of the DSP563xx series.Several related parts can be identified using its base part number, XC56L307.
XC56L307VL150 Features
Supplied in the 196-LBGA package
XC56L307VL150 Applications
There are a lot of NXP USA Inc. XC56L307VL150 DSP applications.
- Audio signal
- Boats
- Encoding/broadcast
- Tomography technology
- Telephone conversations
- Speech processing
- Digital camera
- Biomedical engineering
- Control systems
- Processing system
