XC56L307VL160
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 196-LBGA |
| Supplier Device Package | 196-MAPBGA (15x15) |
| Operating Temperature | -40°C~100°C |
| Packaging | Tray |
| Series | DSP563xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | Fixed Point |
| Base Part Number | XC56L307 |
| Interface | Host Interface, SSI, SCI |
| Voltage - I/O | 3.30V |
| Non-Volatile Memory | ROM (576B) |
| Voltage - Core | 1.80V |
| On Chip Data RAM | 576kB |
| Clock Rate | 160MHz |
| RoHS Status | ROHS3 Compliant |
XC56L307VL160 Overview
It is a type of electronic component available in package 196-LBGA.The packaging way is Tray.In addition to meeting a wide range of requirements, it is a member of Fixed Point.Surface Mount is the direction in which it is mounted.The operation of the device at the temperature of -40°C~100°C ensures the normal operation of the device.The analog voltage range of 3.30V refers to the input or output voltage.The DSP563xx series contains this digital signal processor.With its base part number XC56L307, it is possible to identify a number of related parts.
XC56L307VL160 Features
Supplied in the 196-LBGA package
XC56L307VL160 Applications
There are a lot of NXP USA Inc. XC56L307VL160 DSP applications.
- Statistical signal processing
- Airplanes
- Vehicle electronics
- Boats
- Biometrics
- Audio compression
- Fourier transform
- Other sensor array processing
- Streaming music
- Instrument modeling
