Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
1156-BBGA, FCBGA |
Number of Pins |
1156 |
Supplier Device Package |
1156-FCBGA (35x35) |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2008 |
Series |
Virtex®-6 LXT |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Max Operating Temperature |
85°C |
Min Operating Temperature |
0°C |
Voltage - Supply |
0.95V~1.05V |
Base Part Number |
XC6VLX130T |
Operating Supply Voltage |
1V |
Number of I/O |
600 |
RAM Size |
1.2MB |
Number of Logic Elements/Cells |
128000 |
Total RAM Bits |
9732096 |
Number of LABs/CLBs |
10000 |
Number of Logic Blocks (LABs) |
10000 |
Speed Grade |
2 |
RoHS Status |
ROHS3 Compliant |
XC6VLX130T-2FFG1156C Overview
There are two packages that contain fpga chips: 1156-BBGA, FCBGA package and X package. There are 600 I/Os for better data transfer. The basic building blocks of logic contain 128000 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.95V~1.05V. An FPGA belonging to the Virtex?-6 LXT series is referred to as an FPGA. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. There are 9732096 RAM bits that are available with this device. Parts related to this part can be found using its base part number XC6VLX130T. The RAM si1.2MBe of this FPGA module reaches 1.2MB to ensure normal operation of the program. 1156 pins are designed into the device. A total of 10000 LABs/CLBs make up this FPGA array. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. In operation with 1V, designers can take advantage of its flexibility to the fullest extent. A maximum operating temperature of 85°C can be reached by this module. 0°C should be higher than the operating temperature. Fpga semiconductor consists of 10000 logic blocks (LABs). The supplier of the device package is 1156-FCBGA (35x35).
XC6VLX130T-2FFG1156C Features
600 I/Os
Up to 9732096 RAM bits
1156 LABs/CLBs
85°C gates
10000 logic blocks (LABs)
XC6VLX130T-2FFG1156C Applications
There are a lot of Xilinx Inc. XC6VLX130T-2FFG1156C FPGAs applications.
- Medical imaging
- Data center search engines
- Radar and Sensors
- Video & Image Processing
- Data Center
- Telecommunication
- Industrial,Medical and Scientific Instruments
- Industrial IoT
- Medical Electronics
- Development Boards and Shields for Microcontrollers