Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
676-BBGA, FCBGA |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
Artix-7 |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
676 |
ECCN Code |
3A991.D |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Voltage - Supply |
0.95V~1.05V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
0.95V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B676 |
Operating Supply Voltage |
950mV |
Memory Size |
1GB |
Number of I/O |
400 |
RAM Size |
1.6MB |
Memory Type |
DDR3 |
Propagation Delay |
130 ps |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
215360 |
Total RAM Bits |
13455360 |
Number of LABs/CLBs |
16825 |
Number of Registers |
269200 |
Combinatorial Delay of a CLB-Max |
1.27 ns |
Height Seated (Max) |
2.54mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
ROHS3 Compliant |
XC7A200T-L1FBG676I Overview
There are two packages that contain fpga chips: 676-BBGA, FCBGA package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. 400 I/Os are available for transferring data more efficiently. The basic building blocks of logic contain 215360 logic elements/cells. It is powered from a supply voltage of 0.95V. An FPGA module can be attached to a development board with a Surface Mount-pin. In order to operate it, it requires a voltage supply of 0.95V~1.05V . This is a type of FPGA that is part of the Artix-7 series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. There is an FPGA model contained in Tray in order to conserve space. Fpga chips is designed wFpga chipsh 676 terminations. The RAM bits that are offered by this fpga chips are 13455360. The FPGA module's RAM si1.6MBe reaches 1.6MB in order to ensure that the program operates in a normal manner. This FPGA is built as an array of 16825 LABs/CLBs. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In operation with 950mV, designers can take advantage of its flexibility to the fullest extent. Programs and data can be stored in the 1GB memory embedded in this FPGA module. A total of 269200 registers are used for storing and transferring data between them. DDR3 memory is adapted for storing data and preventing resource conflicts.
XC7A200T-L1FBG676I Features
400 I/Os
Up to 13455360 RAM bits
269200 registers
XC7A200T-L1FBG676I Applications
There are a lot of Xilinx Inc. XC7A200T-L1FBG676I FPGAs applications.
- Artificial intelligence (AI)
- Security systems
- Consumer Electronics
- Space Applications
- Automotive advanced driver assistance systems (ADAS)
- Device controllers
- Software-defined radio
- Bioinformatics
- OpenCL
- Wireless Communications