Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
676-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2010 |
Series |
Kintex®-7 |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
676 |
ECCN Code |
3A991.D |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Voltage - Supply |
0.97V~1.03V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
XC7K325T |
Pin Count |
676 |
JESD-30 Code |
S-PBGA-B676 |
Number of Outputs |
400 |
Qualification Status |
Not Qualified |
Power Supplies |
11.83.3V |
Memory Size |
1GB |
Number of I/O |
400 |
RAM Size |
2MB |
Memory Type |
DDR3 |
Clock Frequency |
1412MHz |
Number of Inputs |
400 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
326080 |
Total RAM Bits |
16404480 |
Number of LABs/CLBs |
25475 |
Speed Grade |
-3 |
Number of Registers |
407600 |
Combinatorial Delay of a CLB-Max |
0.58 ns |
Height Seated (Max) |
3.37mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
ROHS3 Compliant |
XC7K325T-3FFG676E Overview
In the package 676-BBGA, FCBGA, this product is provided. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. 400 I/Os are available for transferring data more efficiently. Logic elements/cells form the fundamental building block of a computer. In order to operate fpga chips, a voltage supply of 1V volts is required. A Field Programmable Gate Arrays-series FPGA part. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 0.97V~1.03V battery. It is a type of FPGA belonging to the Kintex?-7 seies. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. In this device, there are 400 outputs that can be used. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is designed wFpga chipsh 676 terminations. The RAM bits that this device offer is 16404480. Related parts can be found by using its base part number XC7K325T. There is a maximum RAM si2MBe of 2MB on this FPGA module, which is necessary to ensure the normal operation of the program. The FPGA is built as an array of 25475 latches or CLBs. This is a battery operated device that operates on 11.83.3V. Fpga semiconductor is equipped wfpga semiconductorh 676 pin count. Most of the time, it uses a crystal oscillating at 1412MHz to generate the signal. Programs and data can be stored in the 1GB memory embedded in this FPGA module. To store and transfer data, there are 407600 registers that are used. Adapted for storing data, the DDR3 memory avoids resource conflicts.
XC7K325T-3FFG676E Features
400 I/Os
Up to 16404480 RAM bits
407600 registers
XC7K325T-3FFG676E Applications
There are a lot of Xilinx Inc. XC7K325T-3FFG676E FPGAs applications.
- DO-254
- Secure Communication
- Development Boards and Shields for Microcontrollers
- Cryptography
- Data center hardware accelerators
- Solar Energy
- Random logic
- Voice recognition
- Electronic Warfare
- Defense Applications