Parameters |
Qualification Status |
Not Qualified |
Power Supplies |
11.83.3V |
Number of I/O |
300 |
RAM Size |
607.5kB |
Clock Frequency |
1286MHz |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
65600 |
Total RAM Bits |
4976640 |
Number of LABs/CLBs |
5125 |
Speed Grade |
-2 |
Number of Registers |
82000 |
Combinatorial Delay of a CLB-Max |
0.61 ns |
Height Seated (Max) |
2.54mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mounting Type |
Surface Mount |
Package / Case |
676-BBGA, FCBGA |
Surface Mount |
YES |
Number of Pins |
676 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2010 |
Series |
Kintex®-7 |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
676 |
ECCN Code |
3A991.D |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Voltage - Supply |
0.97V~1.03V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
XC7K70T |
Pin Count |
676 |
Number of Outputs |
300 |
XC7K70T-2FBG676C Overview
This package is included in the 676-BBGA, FCBGA package and is available for purchase. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. 300 I/Os are available for transferring data more efficiently. There are 65600 logic elements/cells to form a fundamental building block. 1V volts power it. This FPGA part belongs to the family of Field Programmable Gate Arrays. The Surface Mount-slot connector on the FPGA module can be connected to the development board. With a supply voltage of 0.97V~1.03V, this device operates with ease. It is a type of FPGA belonging to the Kintex?-7 seies. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. In order to make this device as versatile as possible, there are 300 different outputs included. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is designed wFpga chipsh 676 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 4976640 bFpga chipss. In order to find related parts, use the part number XC7K70T as a base. This FPGA module has a RAM si607.5kBe of 607.5kB that is sufficient to make sure that the program is able to run normally. There are 676 pins on this device. Fpga electronics contains 5125 LABs/CLBs in an array. Power is supplied to the device by a 11.83.3V battery. This device has a pin count of 676 in fpga semiconductor. Usually, fpga semiconductor uses a 1286MHz crystal. In order to store and transfer data, a total of 82000 registers are used.
XC7K70T-2FBG676C Features
300 I/Os
Up to 4976640 RAM bits
676 LABs/CLBs
82000 registers
XC7K70T-2FBG676C Applications
There are a lot of Xilinx Inc. XC7K70T-2FBG676C FPGAs applications.
- Data center hardware accelerators
- Medical Applications
- DO-254
- Bioinformatics
- Development Boards and Shields for Microcontrollers
- Automotive Applications
- Filtering and communication encoding
- Data Center
- Random logic
- Digital signal processing