XC7Z007S-1CLG225C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 225-LFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 225 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1V |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| JESD-30 Code | S-PBGA-B225 |
| Supply Voltage-Max (Vsup) | 1.05V |
| Supply Voltage-Min (Vsup) | 0.95V |
| Number of I/O | 54 |
| Speed | 667MHz |
| RAM Size | 256KB |
| Core Processor | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Clock Frequency | 667MHz |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
| RAM (words) | 256000 |
| Primary Attributes | Artix™-7 FPGA, 23K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; PCI; SPI; UART; USB |
| Height Seated (Max) | 1.5mm |
| Length | 13mm |
| Width | 13mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Single ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Single ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 225-LFBGA, CSPBGA package as per the manufacturer's specifications.A 256KB RAM SoC chip provides reliable performance to users.The internal architecture of this SoC design is based on the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines Artix?-7 FPGA, 23K Logic Cells.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 54 inputs and outputs.Use a power supply with a voltage of 1V if possible.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.Power supplies of at least 0.95V are required.system on a chip benefits from 225 terminations.Core architecture of ARM underpins the SoC meaning.A 667MHz clock frequency is followed by this SoC.
Single ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
Clock Frequency: 667MHz
There are a lot of Xilinx Inc.
XC7Z007S-1CLG225C System On Chip (SoC) applications.
- Robotics
- Self-aware system-on-chip (SoC)
- CNC control
- High-end PLC
- Apple smart watch
- Measurement tools
- Networked sensors
- Functional safety for critical applications in the aerospace
- Keywords
- Body control module
