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XC7Z010-1CLG225C

225 Terminations0°C~85°C TJ 225 Pin XC7Z010 System On ChipZynq?-7000 Series 86 I/O1V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XC7Z010-1CLG225C
  • Package: 225-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 325
  • Description: 225 Terminations0°C~85°C TJ 225 Pin XC7Z010 System On ChipZynq?-7000 Series 86 I/O1V (Kg)

Details

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Parameters
Factory Lead Time 1 Week
Contact Plating Copper, Silver, Tin
Package / Case 225-LFBGA, CSPBGA
Surface Mount YES
Number of Pins 225
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 225
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z010
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 86
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Artix™-7 FPGA, 28K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 1.5mm
Length 13mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 225-LFBGA, CSPBGA package as per the manufacturer's specifications.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq?-7000 is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.A significant feature of this SoC security is the combination of Artix?-7 FPGA, 28K Logic Cells.An advanced Tray package houses this SoC system on a chip.86 I/Os in total are included in this SoC part.A 1V power supply is recommended.There is no safe voltage for the SoCs wireless above 1.05V.There are 225 terminations in total and that really benefits system on a chip.You can get system on chips with similar specs and purposes by searching XC7Z010.A frequency of 667MHz is used by the wireless SoC to operate.It uses ARM as its core architecture.This is the version with 225 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z010-1CLG225C System On Chip (SoC) applications.

  • Published Paper
  • External USB hard disk/SSD
  • Efficient hardware for training of neural networks
  • Vending machines
  • Cyberphysical system-on-chip
  • Optical drive
  • Cyber security for critical applications in the aerospace
  • Keyboard
  • Test and Measurement
  • ARM Cortex M4 microcontroller

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