Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Package / Case |
400-LFBGA, CSPBGA |
Surface Mount |
YES |
Number of Pins |
400 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2010 |
Series |
Zynq®-7000 |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
400 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1V |
Terminal Pitch |
0.8mm |
Frequency |
667MHz |
Base Part Number |
XC7Z010 |
Operating Supply Voltage |
1V |
Supply Voltage-Max (Vsup) |
1.05V |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
130 |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Boundary Scan |
YES |
Speed Grade |
-1 |
RAM (words) |
256000 |
Primary Attributes |
Artix™-7 FPGA, 28K Logic Cells |
Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
Height Seated (Max) |
1.6mm |
Length |
17mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 400-LFBGA, CSPBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq?-7000 is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines Artix?-7 FPGA, 28K Logic Cells together.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.Use a power supply with a voltage of 1V if possible.In the SoCs wireless, voltages above 1.05V are considered unsafe.The system on a chip uses 400 terminations in total.Searching XC7Z010 will bring up system on chips with similar specs and purposes.The wireless SoC works at a frequency of 667MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 400.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z010-1CLG400C System On Chip (SoC) applications.
- Communication network-on-Chip (cNoC)
- AC-input BLDC motor drive
- Medical
- Self-aware system-on-chip (SoC)
- Embedded systems
- Industrial transport
- Communication interfaces ( I2C, SPI )
- Automotive
- Digital Media
- Test and Measurement