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XC7Z010-2CLG225I

225 Terminations-40°C~100°C TJ 225 Pin XC7Z010 System On ChipZynq?-7000 Series 86 I/O1V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XC7Z010-2CLG225I
  • Package: 225-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 842
  • Description: 225 Terminations-40°C~100°C TJ 225 Pin XC7Z010 System On ChipZynq?-7000 Series 86 I/O1V (Kg)

Details

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Parameters
Factory Lead Time 1 Week
Contact Plating Copper, Silver, Tin
Package / Case 225-LFBGA, CSPBGA
Surface Mount YES
Number of Pins 225
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 225
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 766MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z010
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 86
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -2
RAM (words) 256000
Primary Attributes Artix™-7 FPGA, 28K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 1.5mm
Length 13mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.The manufacturer assigns this system on a chip with a 225-LFBGA, CSPBGA package.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is a member of the Zynq?-7000 series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.This SoC security combines Artix?-7 FPGA, 28K Logic Cells and that is something to note.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part has a total of 86 I/Os.It is recommended to use a 1V power supply.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.There are 225 terminations in total and that really benefits system on a chip.Search XC7Z010 for system on chips with similar specs and purposes.The wireless SoC works at a frequency of 766MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.The computer SoC has a pin count of 225.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z010-2CLG225I System On Chip (SoC) applications.

  • Mouse
  • Industrial sectors
  • Microprocessors
  • Vending machines
  • Smart appliances
  • Mobile market
  • Digital Signal Processing
  • Transmitters
  • Functional safety for critical applications in the automotive
  • Avionics

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