XC7Z010-L1CLG225I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 225-LFBGA, CSPBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 225 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1V |
| Terminal Pitch | 0.8mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| JESD-30 Code | S-PBGA-B225 |
| Operating Supply Voltage | 1V |
| Supply Voltage-Max (Vsup) | 1.05V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 86 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| RAM (words) | 256000 |
| Primary Attributes | Artix™-7 FPGA, 28K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 1.5mm |
| Length | 13mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Manufacturer assigns package 225-LFBGA, CSPBGA to this system on a chip.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines Artix?-7 FPGA, 28K Logic Cells and that is something to note.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 86.As a rule of thumb, it is advised to use a power supply with a value of 1V.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.Having 225 terminations in total makes system on a chip possible.During operation, the wireless SoC runs at a frequency of 667MHz.It uses ARM as its core architecture.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z010-L1CLG225I System On Chip (SoC) applications.
- Cyber security for critical applications in the aerospace
- Microcontroller
- Optical drive
- Digital Media
- Networked Media Encode/Decode
- Temperature Sensors
- Special Issue Information
- High-end PLC
- Networked sensors
- Measurement tools
