Parameters |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Boundary Scan |
YES |
RAM (words) |
256000 |
Primary Attributes |
Artix™-7 FPGA, 74K Logic Cells |
Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
UV Erasable |
N |
Height Seated (Max) |
1.6mm |
Length |
19mm |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
484-LFBGA, CSPBGA |
Number of Pins |
485 |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2010 |
Series |
Zynq®-7000 |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
485 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Additional Feature |
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
HTS Code |
8542.39.00.01 |
Subcategory |
Other Microprocessor ICs |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1V |
Terminal Pitch |
0.8mm |
Frequency |
667MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.05V |
Power Supplies |
11.8V |
Supply Voltage-Min (Vsup) |
0.95V |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
130 |
RAM Size |
256KB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).The manufacturer assigns this system on a chip with a 484-LFBGA, CSPBGA package as per the manufacturer's specifications.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.Internally, this SoC design uses the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.A significant feature of this SoC security is the combination of Artix?-7 FPGA, 74K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.Ideally, a power supply with a voltage of 1V should be used.The SoCs wireless is considered unreliable if the voltage exceeds 1.05V.It can feed on a power supply of at least 0.95V.A system on a chip benefits from having 485 terminations.The system on a chip capability is outstanding just like it is for other high-quality Other Microprocessor ICs.In order to operate system on chip, you will need 11.8V power supplies.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.It operates at a frequency of 667MHz.The SoC meaning is based on the core architecture of ARM.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.This is the version with 485 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z015-1CLG485I System On Chip (SoC) applications.
- Temperature
- Central alarm system
- Defense
- External USB hard disk/SSD
- String inverter
- ARM
- Digital Media
- Robotics
- sequence controllers
- Networked Media Encode/Decode