Parameters |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
485 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Additional Feature |
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
HTS Code |
8542.39.00.01 |
Subcategory |
Other Microprocessor ICs |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1V |
Terminal Pitch |
0.8mm |
Frequency |
866MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.05V |
Power Supplies |
11.8V |
Supply Voltage-Min (Vsup) |
0.95V |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
130 |
RAM Size |
256KB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Boundary Scan |
YES |
RAM (words) |
256000 |
Primary Attributes |
Artix™-7 FPGA, 74K Logic Cells |
Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
UV Erasable |
N |
Height Seated (Max) |
1.6mm |
Length |
19mm |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
484-LFBGA, CSPBGA |
Number of Pins |
485 |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2010 |
Series |
Zynq®-7000 |
JESD-609 Code |
e1 |
Part Status |
Active |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC is built.Its package is 484-LFBGA, CSPBGA.With 256KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.The Zynq?-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.In addition, this SoC security combines Artix?-7 FPGA, 74K Logic Cells.An advanced Tray package houses this SoC system on a chip.This SoC part has a total of 130 I/Os.Use a power supply with a voltage of 1V if possible.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.This SoC system on a chip can run on a power supply that is at least 0.95V.There are 485 terminations in total and that really benefits system on a chip.In the same way that other high-quality Other Microprocessor ICs will do, it is also capable of providing outstanding performance.You will need to provide 11.8V power supplies in order to run system on chip.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.At 866MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The computer SoC is the 485-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z015-3CLG485E System On Chip (SoC) applications.
- DC-input BLDC motor drive
- Body control module
- sequence controllers
- Digital Signal Processing
- External USB hard disk/SSD
- Video Imaging
- Industrial transport
- ARM support modules
- Medical
- Sports