Parameters |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
485 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Additional Feature |
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
HTS Code |
8542.39.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1V |
Terminal Pitch |
0.8mm |
Frequency |
667MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B485 |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Max Supply Voltage |
1.05V |
Min Supply Voltage |
950mV |
Number of I/O |
130 |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Propagation Delay |
120 ps |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Core Architecture |
ARM |
Boundary Scan |
YES |
RAM (words) |
256000 |
Primary Attributes |
Artix™-7 FPGA, 74K Logic Cells |
Number of Registers |
92400 |
Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
Height Seated (Max) |
1.6mm |
Length |
19mm |
Width |
19mm |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
484-LFBGA, CSPBGA |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2010 |
Series |
Zynq®-7000 |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.It has been assigned a package 484-LFBGA, CSPBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.In the Zynq?-7000 series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines Artix?-7 FPGA, 74K Logic Cells and that is something to note.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V rating is recommended.Having 485 terminations in total makes system on a chip possible.A frequency of 667MHz is used by the wireless SoC to operate.In this SoC meaning, ARM serves as the core architecture.Furthermore, this SoC processor also incorporates additional features similar to PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY which are available on other SoC processors also.According to its specification, the maximum voltage SoC can handle is 1.05V.As long as it receives at least 950mV of power, then it is working.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z015-L1CLG485I System On Chip (SoC) applications.
- Smart appliances
- Vending machines
- Digital Media
- USB hard disk enclosure
- POS Terminals
- Functional safety for critical applications in the industrial sectors
- Networked sensors
- ARM support modules
- ARM processors
- Optical drive