Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Package / Case |
400-LFBGA, CSPBGA |
Surface Mount |
YES |
Number of Pins |
400 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
Zynq®-7000 |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
400 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1V |
Terminal Pitch |
0.8mm |
Frequency |
667MHz |
Base Part Number |
XC7Z020 |
Operating Supply Voltage |
1V |
Supply Voltage-Max (Vsup) |
1.05V |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
130 |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Boundary Scan |
YES |
Speed Grade |
-1 |
RAM (words) |
256000 |
Primary Attributes |
Artix™-7 FPGA, 85K Logic Cells |
Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
Height Seated (Max) |
1.6mm |
Length |
17mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Assigned with the package 400-LFBGA, CSPBGA, this system on a chip comes from the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.A significant feature of this SoC security is the combination of Artix?-7 FPGA, 85K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.130 I/Os are included in this SoC part.A 1V power supply should be used.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.There are 400 terminations in total and that really benefits system on a chip.You can get system on chips with similar specs and purposes by searching XC7Z020.A wireless SoC that operates at a frequency of 667MHz is what the wireless SoC does.In this SoC meaning, ARM serves as the core architecture.This is the 400-pin version of the computer SoC.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z020-1CLG400C System On Chip (SoC) applications.
- Cyber security for critical applications in the aerospace
- Networked sensors
- Temperature Sensors
- Robotics
- Smart appliances
- Industrial AC-DC
- Multiprocessor system-on-chips (MPSoCs)
- Medical
- Published Paper
- Networked Media Encode/Decode