XC7Z030-1FBG484C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Package / Case | 484-BBGA, FCBGA |
| Surface Mount | YES |
| Number of Pins | 484 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 484 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC7Z030 |
| Operating Supply Voltage | 1V |
| Supply Voltage-Max (Vsup) | 1.05V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | -1 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 2.54mm |
| Length | 23mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.According to the manufacturer, this system on a chip has a package of 484-BBGA, FCBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.Ideally, a power supply with a voltage of 1V should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.A system on a chip benefits from having 484 terminations.You can get system on chips with similar specs and purposes by searching XC7Z030.There is 667MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.This is the version with 484 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG484C System On Chip (SoC) applications.
- Published Paper
- Cyberphysical system-on-chip
- Sports
- ARM
- Functional safety for critical applications in the automotive
- Microcontroller based SoC ( RISC-V, ARM)
- Wireless sensor networks
- Level
- String inverter
- Body control module
