XC7Z030-1FBG484I
| Parameters | |
|---|---|
| Supply Voltage-Max (Vsup) | 1.05V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | -1 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 2.54mm |
| Length | 23mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Package / Case | 484-BBGA, FCBGA |
| Surface Mount | YES |
| Number of Pins | 484 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 484 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC7Z030 |
| Operating Supply Voltage | 1V |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.Package 484-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.In the Zynq?-7000 series, this system on chip SoC is included.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.Total I/Os on this SoC part are 130.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless is considered unreliable if the voltage exceeds 1.05V.As a result, there are 484 terminations in total, which does really benefit system on a chip.You can get system on chips with similar specs and purposes by searching XC7Z030.wireless SoCs operate at 667MHz.In this SoC meaning, ARM serves as the core architecture.The computer SoC has a pin count of 484.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG484I System On Chip (SoC) applications.
- Video Imaging
- Vending machines
- Samsung galaxy gear
- Digital Signal Processing
- Medical Pressure
- Central alarm system
- RISC-V
- Networked Media Encode/Decode
- Functional safety for critical applications in the industrial sectors
- Mobile computing
