XC7Z030-1FFG676I
| Parameters | |
|---|---|
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | -1 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| UV Erasable | N |
| Height Seated (Max) | 3.24mm |
| Length | 27mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Package / Case | 676-BBGA, FCBGA |
| Surface Mount | YES |
| Number of Pins | 676 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other uPs/uCs/Peripheral ICs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC7Z030 |
| Pin Count | 676 |
| Operating Supply Voltage | 1V |
| Supply Voltage-Max (Vsup) | 1.05V |
| Power Supplies | 11.8V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC is built.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package.A 256KB RAM SoC chip provides reliable performance to users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Kintex?-7 FPGA, 125K Logic Cells and that is something to note.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 130.Use a power supply with a voltage of 1V if possible.The SoCs wireless is considered unreliable if the voltage exceeds 1.05V.system on a chip benefits from 676 terminations.Just like other high-quality Other uPs/uCs/Peripheral ICs will do, it is of outstanding system on a chip capability.In order to use system on chip, you will need a power supply of 11.8V.Search XC7Z030 for system on chips with similar specs and purposes.wireless SoCs operate at 667MHz.It uses ARM as its core architecture.The computer SoC has a pin count of 676.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FFG676I System On Chip (SoC) applications.
- Deep learning hardware
- Vending machines
- Temperature
- Mobile computing
- Healthcare
- Industrial automation devices
- Samsung galaxy gear
- Vending machines
- Smartphone accessories
- Sensor network-on-chip (sNoC)
