Parameters |
Factory Lead Time |
1 Week |
Package / Case |
484-BBGA, FCBGA |
Surface Mount |
YES |
Number of Pins |
484 |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
Zynq®-7000 |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
484 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
250 |
Supply Voltage |
1V |
Terminal Pitch |
1mm |
Frequency |
800MHz |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
XC7Z030 |
Supply Voltage-Max (Vsup) |
1.05V |
Supply Voltage-Min (Vsup) |
0.95V |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
130 |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Boundary Scan |
YES |
Speed Grade |
-2 |
RAM (words) |
256000 |
Primary Attributes |
Kintex™-7 FPGA, 125K Logic Cells |
Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
Height Seated (Max) |
2.54mm |
Length |
23mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 484-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.In addition, this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V rating is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.At least 0.95V can be supplied as a power source.system on a chip benefits from 484 terminations.Search XC7Z030 for system on chips with similar specs and purposes.The wireless SoC works at a frequency of 800MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.The computer SoC is the 484-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-2FBG484E System On Chip (SoC) applications.
- Remote control
- Wireless sensor networks
- Automotive
- Mouse
- Communication network-on-Chip (cNoC)
- Measurement tools
- Level
- String inverter
- Efficient hardware for inference of neural networks
- Optical drive