Parameters |
Factory Lead Time |
1 Week |
Package / Case |
484-FBGA, FCBGA |
Number of Pins |
485 |
Supplier Device Package |
485-FCBGA (19x19) |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
Zynq®-7000 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Max Operating Temperature |
100°C |
Min Operating Temperature |
-40°C |
Frequency |
800MHz |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
130 |
Speed |
800MHz |
RAM Size |
256KB |
Memory Type |
ROMless |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Max Frequency |
800MHz |
Primary Attributes |
Kintex™-7 FPGA, 125K Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.There is a 484-FBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.Tray package houses this SoC system on a chip.This SoC part contains a total of 130 I/Os in total.wireless SoCs operate at 800MHz.In terms of core architecture, the SoC meaning relies on ARM.The computer SoC has 485 pins.The SoC computing will start only if -40°C is set.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 100°C.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-2SB485I System On Chip (SoC) applications.
- Healthcare
- Networked Media Encode/Decode
- Smartphones
- USB hard disk enclosure
- Keyboard
- Vending machines
- Level
- Multiprocessor system-on-chips (MPSoCs)
- sequence controllers
- Functional safety for critical applications in the industrial sectors