XC7Z030-2SBG485I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 484-FBGA, FCBGA |
| Number of Pins | 485 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 485 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Microprocessor ICs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Terminal Pitch | 0.8mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.05V |
| Power Supplies | 11.8V |
| Supply Voltage-Min (Vsup) | 0.95V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| UV Erasable | N |
| Height Seated (Max) | 2.44mm |
| Length | 19mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.It has been assigned a package 484-FBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq?-7000 is the series number of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells is important.Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.It is advised to utilize a 1V power supply.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.At least 0.95V can be supplied as a power source.There are 485 terminations in total and that really benefits system on a chip.This system on a chip is just as capable as any other high-quality Other Microprocessor ICs.There is 11.8V power supply requirement for this system on chip SoC.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.There is 800MHz frequency associated with the wireless SoC.This SoC meaning utilizes a core architecture of ARM as its foundation.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.In this computer SoC, there are 485 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z030-2SBG485I System On Chip (SoC) applications.
- ARM Cortex M4 microcontroller
- Functional safety for critical applications in the industrial sectors
- Sensor network-on-chip (sNoC)
- Keywords
- Personal Computers
- Industrial automation devices
- Video Imaging
- Functional safety for critical applications in the aerospace
- Communication interfaces ( I2C, SPI )
- Cyber security for critical applications in the aerospace
