XC7Z030-3FBG484E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Package / Case | 484-BBGA, FCBGA |
| Surface Mount | YES |
| Number of Pins | 484 |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 1GHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC7Z030 |
| Operating Supply Voltage | 1V |
| Supply Voltage-Max (Vsup) | 1.05V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | -3 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 2.54mm |
| Length | 23mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Its package is 484-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.Ideally, a power supply with a voltage of 1V should be used.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.Having 484 terminations in total makes system on a chip possible.You can get system on chips with similar specs and purposes by searching XC7Z030.In this wireless SoC, the frequency is set to 1GHz.The SoC meaning is based on the core architecture of ARM.This is the version with 484 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-3FBG484E System On Chip (SoC) applications.
- sequence controllers
- Keyboard
- Industrial sectors
- Automotive gateway
- Robotics
- Video Imaging
- RISC-V
- Flow Sensors
- Communication interfaces ( I2C, SPI )
- POS Terminals
