XC7Z030-L2FBG676I
| Parameters | |
|---|---|
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Number of Registers | 157200 |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 2.54mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 676-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Max Supply Voltage | 1.05V |
| Min Supply Voltage | 950mV |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is part of the Zynq?-7000 series of system on a chips.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 125K Logic Cells.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os in total are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.In total, there are 676 terminations, so system on a chip is really aided by this.In this wireless SoC, the frequency is set to 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.It has a maximum supply voltage of 1.05V rated for it.A minimum of 950mV are supplied to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z030-L2FBG676I System On Chip (SoC) applications.
- System-on-chip (SoC)
- Sensor network-on-chip (sNoC)
- Industrial automation devices
- Test and Measurement
- AC drive control module
- Industrial robot
- Print Special Issue Flyer
- String inverter
- Central alarm system
- Smart appliances
