XC7Z035-1FBG676C
| Parameters | |
|---|---|
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Max Supply Voltage | 1.05V |
| Min Supply Voltage | 950mV |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Propagation Delay | 120 ps |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | 1 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Number of Registers | 343800 |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 2.54mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 676-BBGA, FCBGA |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Technology | CMOS |
| Terminal Position | BOTTOM |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq?-7000 is the series number of this system on chip SoC.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells is important.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.This SoC part has a total of 130 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1V.The system on a chip uses 676 terminations in total.A wireless SoC that operates at a frequency of 667MHz is what the wireless SoC does.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Voltage of maximum supply is 1.05V.Power is supplied to it at least in the amount of 950mV.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-1FBG676C System On Chip (SoC) applications.
- Central inverter
- Deep learning hardware
- Measurement tools
- Microcontroller
- USB hard disk enclosure
- Wireless networking
- Measurement testers
- Healthcare
- Body control module
- ARM Cortex M4 microcontroller
