XC7Z035-1FFG900I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Number of Pins | 900 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Operating Supply Voltage | 1V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Propagation Delay | 130 ps |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | 1 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Number of Registers | 343800 |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 3.35mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Its package is 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.It is important to note that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1V.In total, there are 900 terminations, which makes system on a chip possible.The wireless SoC works at a frequency of 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.In this computer SoC, there are 900 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-1FFG900I System On Chip (SoC) applications.
- Fitness
- sequence controllers
- String inverter
- Published Paper
- Industrial
- AC drive control module
- Central inverter
- Medical
- External USB hard disk/SSD
- Remote control
