XC7Z035-2FFG900E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 900-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| JESD-30 Code | S-PBGA-B900 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Max Supply Voltage | 1.05V |
| Min Supply Voltage | 950mV |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Propagation Delay | 100 ps |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | 2 |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Number of Registers | 343800 |
| Height Seated (Max) | 3.35mm |
| Length | 31mm |
| Width | 31mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the Zynq?-7000 series.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.A key point to note is that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.An advanced Tray package houses this SoC system on a chip.130 I/Os in total are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.There are 900 terminations in total and that really benefits system on a chip.A wireless SoC that operates at a frequency of 800MHz is what the wireless SoC does.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.There is a maximum supply voltage of 1.05V.At least 950mV power is delivered to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-2FFG900E System On Chip (SoC) applications.
- Temperature
- POS Terminals
- Networked sensors
- Digital Media
- Avionics
- Servo drive control module
- Transmitters
- Mobile computing
- Mouse
- Industrial sectors
