XC7Z035-2FFG900I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 900-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| JESD-30 Code | S-PBGA-B900 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Max Supply Voltage | 1.05V |
| Min Supply Voltage | 950mV |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Propagation Delay | 100 ps |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | 2 |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Number of Registers | 343800 |
| Height Seated (Max) | 3.35mm |
| Length | 31mm |
| Width | 31mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.A system on chip SoC of this type belongs to the Zynq?-7000 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.It is important to note that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V rating is recommended.system on a chip benefits from 900 terminations.It operates at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Moreover, this SoC processor comes with PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The maximum supply voltage is rated as 1.05V.The SoC security is powered at least by 950mV.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-2FFG900I System On Chip (SoC) applications.
- Measurement tools
- Avionics
- Wireless networking
- POS Terminals
- Mobile market
- Smartphones
- Keywords
- Efficient hardware for training of neural networks
- Healthcare
- Multiprocessor system-on-chips (MPSoCs)
