XC7Z035-3FBG676E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 676-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Max Supply Voltage | 1.05V |
| Min Supply Voltage | 950mV |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Propagation Delay | 110 ps |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | 3 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Number of Registers | 343800 |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 2.54mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 275K Logic Cells.An advanced Tray package houses this SoC system on a chip.130 I/Os are available in this SoC part.For safe operation, it is advisable to utilize a power supply with 1V voltage.It is really beneficial to have system on a chip since there are 676 terminations in total.A frequency of 800MHz is used by the wireless SoC to operate.Based on the core architecture of ARM, the SoC meaning has a high level of performance.A maximum supply voltage of 1.05V is specified for the SoC security.At least 950mV power is delivered to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-3FBG676E System On Chip (SoC) applications.
- Special Issue Information
- Multiprocessor system-on-chips (MPSoCs)
- Cyber security for critical applications in the aerospace
- Industrial AC-DC
- Microprocessors
- Communication network-on-Chip (cNoC)
- Video Imaging
- Industrial robot
- Cyberphysical system-on-chip
- Medical
