XC7Z035-3FFG900E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 900-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| JESD-30 Code | S-PBGA-B900 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Max Supply Voltage | 1.05V |
| Min Supply Voltage | 950mV |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Propagation Delay | 90 ps |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | 3 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Number of Registers | 343800 |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Zynq?-7000 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.This SoC security combines Kintex?-7 FPGA, 275K Logic Cells, an important feature to keep in mind.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.Use a power supply with a voltage of 1V if possible.In total, there are 900 terminations, so system on a chip is really aided by this.A frequency of 800MHz is used by the wireless SoC to operate.Core architecture of ARM underpins the SoC meaning.It is rated with 1.05V maximum supply voltage.As long as it receives at least 950mV of power, then it is working.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-3FFG900E System On Chip (SoC) applications.
- String inverter
- Industrial transport
- Wireless networking
- ARM processors
- Microcontroller based SoC ( RISC-V, ARM)
- Apple smart watch
- Deep learning hardware
- ARM support modules
- Industrial Pressure
- DC-input BLDC motor drive
