XC7Z035-L2FBG676I
| Parameters | |
|---|---|
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Supply Voltage-Max (Vsup) | 1.05V |
| Supply Voltage-Min (Vsup) | 0.95V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 2.54mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Package / Case | 676-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Package 676-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 275K Logic Cells.It is packaged in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.A 1V power supply is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.Power supply should be at least 0.95V.It is really beneficial to have system on a chip since there are 676 terminations in total.In this wireless SoC, the frequency is set to 800MHz.It uses ARM as its core architecture.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-L2FBG676I System On Chip (SoC) applications.
- Measurement testers
- Industrial automation devices
- Industrial sectors
- Automotive
- sequence controllers
- Sports
- Flow Sensors
- Multiprocessor system-on-chips (MPSoCs)
- Cyber security for critical applications in the aerospace
- Sensor network-on-chip (sNoC)
