XC7Z045-1FFG900C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Number of Pins | 900 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC7Z045 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Max Supply Voltage | 3.3V |
| Min Supply Voltage | 1.2V |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Memory Type | ROMless |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Number of Logic Elements/Cells | 190000 |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | -1 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 3.35mm |
| Length | 31mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides users with reliable performance.Internally, this SoC design uses the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V rating is recommended.In total, there are 900 terminations, so system on a chip is really aided by this.Searching XC7Z045 will bring up system on chips with similar specs and purposes.During operation, the wireless SoC runs at a frequency of 667MHz.It uses ARM as its core architecture.The computer SoC is the 900-pin version.Supply voltage is rated at 3.3V.A minimum of 1.2V power is supplied to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FFG900C System On Chip (SoC) applications.
- Functional safety for critical applications in the automotive
- Embedded systems
- Measurement tools
- Wireless networking
- Cyberphysical system-on-chip
- Networked sensors
- Keywords
- Networked sensors
- Wireless sensor networks
- Flow Sensors
