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XC7Z045-2FBG676E

0°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XC7Z045-2FBG676E
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 316
  • Description: 0°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O(Kg)

Details

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Parameters
Factory Lead Time 1 Week
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature 0°C
Frequency 800MHz
Base Part Number XC7Z045
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
Speed 800MHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Max Frequency 733MHz
Speed Grade -2
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.The average operating temps for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.Search XC7Z045 for system on chips with similar specs and purposes.800MHz is the wireless SoC's frequency.In this SoC meaning, ARM serves as the core architecture.It is just enough to start the SoC computing at 0°C.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

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XC7Z045-2FBG676E System On Chip (SoC) applications.

  • System-on-chip (SoC)
  • Robotics
  • Medical Pressure
  • Cyber security for critical applications in the aerospace
  • Optical drive
  • Healthcare
  • Vending machines
  • Functional safety for critical applications in the aerospace
  • Medical
  • Industrial transport

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