XC7Z045-2FFG676E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Package / Case | 676-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC7Z045 |
| JESD-30 Code | S-PBGA-B676 |
| Operating Supply Voltage | 1V |
| Supply Voltage-Max (Vsup) | 1.05V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Memory Type | ROMless |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | -2 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 3.37mm |
| Length | 27mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Package 676-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series name of this system on chip SoC.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.This SoC security combines Kintex?-7 FPGA, 350K Logic Cells, an important feature to keep in mind.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.A power supply with a 1V rating is recommended.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.In total, there are 676 terminations, so system on a chip is really aided by this.Search XC7Z045 for system on chips with similar specs and purposes.A frequency of 800MHz is used by the wireless SoC to operate.In terms of core architecture, the SoC meaning relies on ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG676E System On Chip (SoC) applications.
- Personal Computers
- Print Special Issue Flyer
- Industrial robot
- Remote control
- Fitness
- Efficient hardware for inference of neural networks
- Functional safety for critical applications in the automotive
- Samsung galaxy gear
- Industrial sectors
- Optical drive
