Parameters |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
Zynq®-7000 |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
676 |
ECCN Code |
3A991.D |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
245 |
Supply Voltage |
1V |
Terminal Pitch |
1mm |
Frequency |
800MHz |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
XC7Z045 |
JESD-30 Code |
S-PBGA-B676 |
Operating Supply Voltage |
1V |
Supply Voltage-Max (Vsup) |
1.05V |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
130 |
RAM Size |
256KB |
Memory Type |
ROMless |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Boundary Scan |
YES |
Speed Grade |
-2 |
RAM (words) |
256000 |
Primary Attributes |
Kintex™-7 FPGA, 350K Logic Cells |
Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
Height Seated (Max) |
3.37mm |
Length |
27mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Package / Case |
676-BBGA, FCBGA |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Kintex?-7 FPGA, 350K Logic Cells and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.system on a chip benefits from 676 terminations.XC7Z045 will give you system on chips with similar specifications and purposes.A frequency of 800MHz is used by the wireless SoC to operate.Based on the core architecture of ARM, the SoC meaning has a high level of performance.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG676I System On Chip (SoC) applications.
- Cyber security for critical applications in the aerospace
- Defense
- Automated sorting equipment
- Personal Computers
- Temperature
- ARM
- Avionics
- Digital Media
- Central alarm system
- Level