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XC7Z045-2FFG900E

900 Terminations0°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XC7Z045-2FFG900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 268
  • Description: 900 Terminations0°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

Details

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Parameters
Factory Lead Time 1 Week
Contact Plating Copper, Silver, Tin
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
JESD-30 Code S-PBGA-B900
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Memory Type ROMless
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -2
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.35mm
Length 31mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.130 I/Os are included in this SoC part.Use a power supply with a voltage of 1V if possible.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.system on a chip benefits from 900 terminations.Searching XC7Z045 will yield system on chips with similar specs and purposes.The wireless SoC works at a frequency of 800MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z045-2FFG900E System On Chip (SoC) applications.

  • Smart appliances
  • Fitness
  • Smartphone accessories
  • Robotics
  • AC drive control module
  • AC-input BLDC motor drive
  • Measurement testers
  • Temperature
  • Apple smart watch
  • Cyber security for critical applications in the aerospace

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