Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Package / Case |
900-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
Zynq®-7000 |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
900 |
ECCN Code |
3A991.D |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
245 |
Supply Voltage |
1V |
Terminal Pitch |
1mm |
Frequency |
800MHz |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
XC7Z045 |
JESD-30 Code |
S-PBGA-B900 |
Operating Supply Voltage |
1V |
Supply Voltage-Max (Vsup) |
1.05V |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
130 |
RAM Size |
256KB |
Memory Type |
ROMless |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Boundary Scan |
YES |
Speed Grade |
-2 |
RAM (words) |
256000 |
Primary Attributes |
Kintex™-7 FPGA, 350K Logic Cells |
Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
Height Seated (Max) |
3.35mm |
Length |
31mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.130 I/Os are included in this SoC part.Use a power supply with a voltage of 1V if possible.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.system on a chip benefits from 900 terminations.Searching XC7Z045 will yield system on chips with similar specs and purposes.The wireless SoC works at a frequency of 800MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900E System On Chip (SoC) applications.
- Smart appliances
- Fitness
- Smartphone accessories
- Robotics
- AC drive control module
- AC-input BLDC motor drive
- Measurement testers
- Temperature
- Apple smart watch
- Cyber security for critical applications in the aerospace