XC7Z045-3FBG676E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Package / Case | 676-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 1GHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC7Z045 |
| JESD-30 Code | S-PBGA-B676 |
| Operating Supply Voltage | 1V |
| Supply Voltage-Max (Vsup) | 1.05V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Memory Type | ROMless |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | -3 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 2.54mm |
| Length | 27mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.In total, there are 676 terminations, which is great for system on a chip.Search XC7Z045 for system on chips with similar specs and purposes.At 1GHz, the wireless SoC works.There are a number of features to this SoC meaning which are based on the core architecture of ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-3FBG676E System On Chip (SoC) applications.
- Efficient hardware for training of neural networks
- PC peripherals
- Medical
- Temperature Sensors
- Robotics
- Central inverter
- Functional safety for critical applications in the industrial sectors
- Medical Pressure
- Personal Computers
- Networked Media Encode/Decode
