XC7Z045-L2FFG900I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| JESD-30 Code | S-PBGA-B900 |
| Supply Voltage-Max (Vsup) | 1.05V |
| Supply Voltage-Min (Vsup) | 0.95V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 3.35mm |
| Length | 31mm |
| Width | 31mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Featured system on chip SoCs of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A key point to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.A 1V power supply is recommended.In the SoCs wireless, voltages above 1.05V are considered unsafe.As long as it receives a power supply that is at least 0.95V, it should be able to function.In total, there are 900 terminations, so system on a chip is really aided by this.It operates at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Moreover, this SoC processor comes with PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z045-L2FFG900I System On Chip (SoC) applications.
- Vending machines
- Functional safety for critical applications in the aerospace
- Keyboard
- Print Special Issue Flyer
- Automotive gateway
- USB hard disk enclosure
- Industrial robot
- Cyber security for critical applications in the aerospace
- CNC control
- POS Terminals
