Parameters |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Boundary Scan |
YES |
Speed Grade |
-1 |
RAM (words) |
256000 |
Primary Attributes |
Kintex™-7 FPGA, 444K Logic Cells |
Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
Height Seated (Max) |
3.1mm |
Length |
35mm |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
1156-BBGA, FCBGA |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2010 |
Series |
Zynq®-7000 |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
ECCN Code |
3A991.D |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
245 |
Supply Voltage |
1V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Frequency |
667MHz |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
S-PBGA-B1156 |
Supply Voltage-Max (Vsup) |
1.05V |
Supply Voltage-Min (Vsup) |
0.95V |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
250 |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package as per the manufacturer's specifications.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.A system on chip SoC of this type belongs to the Zynq?-7000 series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 444K Logic Cells together.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 250 I/Os.A power supply with a 1V rating is recommended.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.Power supply should be at least 0.95V.It operates at a frequency of 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z100-1FFG1156I System On Chip (SoC) applications.
- Functional safety for critical applications in the aerospace
- Cyber security for critical applications in the aerospace
- Fitness
- Industrial robot
- CNC control
- External USB hard disk/SSD
- Central alarm system
- Published Paper
- Mobile market
- Measurement testers