Parameters |
Primary Attributes |
Kintex™-7 FPGA, 444K Logic Cells |
Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
Height Seated (Max) |
3.35mm |
Length |
31mm |
Width |
31mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
Package / Case |
900-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tube |
Published |
2010 |
Series |
Zynq®-7000 |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
900 |
ECCN Code |
3A991.D |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
245 |
Supply Voltage |
1V |
Terminal Pitch |
1mm |
Frequency |
667MHz |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
XC7Z100 |
JESD-30 Code |
S-PBGA-B900 |
Supply Voltage-Max (Vsup) |
1.05V |
Supply Voltage-Min (Vsup) |
0.95V |
Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
212 |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Core Architecture |
ARM |
Boundary Scan |
YES |
RAM (words) |
256000 |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq?-7000 series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 444K Logic Cells.There is a state-of-the-art Tube package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 212 I/Os.A power supply with a 1V rating is recommended.In the SoCs wireless, voltages above 1.05V are considered unsafe.Power supply should be at least 0.95V.A system on a chip benefits from having 900 terminations.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z100.At 667MHz, the wireless SoC works.Core architecture of ARM underpins the SoC meaning.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z100-1FFG900I System On Chip (SoC) applications.
- Cyberphysical system-on-chip
- Mouse
- Industrial AC-DC
- Smartphones
- Industrial transport
- Functional safety for critical applications in the automotive
- Keywords
- Healthcare
- Microcontroller
- Deep learning hardware