Parameters |
Factory Lead Time |
1 Week |
Package / Case |
900-BBGA, FCBGA |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq®-7000 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of I/O |
212 |
Speed |
800MHz |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Kintex™-7 FPGA, 444K Logic Cells |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq?-7000 series.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 444K Logic Cells.An advanced Tray package houses this SoC system on a chip.This SoC part contains a total of 212 I/Os in total.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XC7Z100-2FF900I System On Chip (SoC) applications.
- Sensor network-on-chip (sNoC)
- PC peripherals
- Healthcare
- High-end PLC
- Networked sensors
- sequence controllers
- AC drive control module
- Smart appliances
- Defense
- Mobile market