banner_page

XCCACEM32-BG388I

MODULE FLASH 32MB 388BBGA


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCCACEM32-BG388I
  • Package: 388-BBGA
  • Datasheet: PDF
  • Stock: 150
  • Description: MODULE FLASH 32MB 388BBGA(Kg)

Details

Tags

Parameters
Parallel/Serial SERIAL
Endurance 1000000 Write/Erase Cycles
Data Retention Time-Min 20
Height Seated (Max) 2.87mm
Length 35mm
Width 35mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Package / Case 388-BBGA
Surface Mount YES
Number of Pins 388
Published 1999
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 388
Terminal Finish TIN LEAD
Max Operating Temperature 85°C
Min Operating Temperature -40°C
HTS Code 8542.32.00.71
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Frequency 133MHz
Pin Count 388
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.83.3V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.71V
Memory Size 32MB
Memory Type FLASH
Supply Current-Max 0.24mA
Organization 2MX16
Memory Width 16
Memory Density 33554432 bit
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good