XCCACEM32-BG388I
| Parameters | |
|---|---|
| Parallel/Serial | SERIAL |
| Endurance | 1000000 Write/Erase Cycles |
| Data Retention Time-Min | 20 |
| Height Seated (Max) | 2.87mm |
| Length | 35mm |
| Width | 35mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
| Package / Case | 388-BBGA |
| Surface Mount | YES |
| Number of Pins | 388 |
| Published | 1999 |
| JESD-609 Code | e0 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 388 |
| Terminal Finish | TIN LEAD |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.32.00.71 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1.27mm |
| Frequency | 133MHz |
| Pin Count | 388 |
| Supply Voltage-Max (Vsup) | 1.89V |
| Power Supplies | 1.83.3V |
| Temperature Grade | INDUSTRIAL |
| Supply Voltage-Min (Vsup) | 1.71V |
| Memory Size | 32MB |
| Memory Type | FLASH |
| Supply Current-Max | 0.24mA |
| Organization | 2MX16 |
| Memory Width | 16 |
| Memory Density | 33554432 bit |
See Relate Datesheet
