Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mounting Type |
Surface Mount |
Package / Case |
64-TBGA |
Surface Mount |
YES |
Number of Pins |
64 |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Published |
2005 |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
64 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Technology |
CMOS |
Voltage - Supply |
1.7V~2V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Supply Voltage |
1.8V |
Terminal Pitch |
1mm |
Frequency |
50MHz |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
XCF128X |
Pin Count |
64 |
Supply Voltage-Max (Vsup) |
2V |
Power Supplies |
1.81.8/3.3V |
Supply Voltage-Min (Vsup) |
1.7V |
Programmable Type |
In System Programmable |
Memory Size |
128Mb |
Memory Type |
FLASH |
Supply Current-Max |
0.053mA |
Access Time |
85 ns |
Organization |
8MX16 |
Memory Width |
16 |
Standby Current-Max |
0.000075A |
Memory Density |
134217728 bit |
Parallel/Serial |
PARALLEL |
Programming Voltage |
1.8V |
Data Polling |
NO |
Toggle Bit |
NO |
Command User Interface |
YES |
Number of Sectors/Size |
4127 |
Page Size |
4words |
Ready/Busy |
YES |
Common Flash Interface |
YES |
Height Seated (Max) |
1.2mm |
Length |
13mm |
Width |
10mm |
Radiation Hardening |
No |
REACH SVHC |
Unknown |
RoHS Status |
ROHS3 Compliant |
XCF128XFTG64C Overview
FPGA uses a neat 64-TBGA package.Packaging for the external use of Tray.-40°C~85°C-qualified.The In System Programmable programming language can be used to program it.With a voltage of 1.7V~2V, it is powered.Surface Mount is the mounting position of this memory device.Data storage is limited to a size of 128Mb bytes.You can search "XCF128X" for other related parts.Supply voltage 1.8V is required.64 terminations with different functions.FPGA is possible to use this memory device wFPGAh a maximum voltage of 2V.If the device needs to be supplied with power, then a minimum voltage of 1.7V is required.The reflow soldering process should be done at a temperature no higher than 260.In this case, it has 64 pins.In this memory, data is transmitted using the PARALLEL process.The memory chip operates at a voltage of no more than 0.053mA.In the package, you will find a set of 64 pins.The best power supply to use is a 1.81.8/3.3V power supply, which is highly recommended.Known as a FLASH memory.The switching controller works at a frequency of 50MHz.
XCF128XFTG64C Features
Operating temperature: -40°C~85°C.
In System Programmable program capability.
PARALLEL processing.
FLASH memory
Frequency: 50MHz.
XCF128XFTG64C Applications
There are a lot of Xilinx Inc. XCF128XFTG64C applications of configuration proms for FPGAs.
- cell phones
- eDRAM
- servers
- workstations,
- Camcorders
- graphics card
- hard disk drive (HDD)
- nonvolatile BIOS memory
- Cache memory
- embedded logic