Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
1156-BBGA, FCBGA |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2012 |
Series |
Kintex® UltraScale™ |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
ECCN Code |
3A991.D |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Voltage - Supply |
0.922V~0.979V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
0.95V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B1156 |
Number of Outputs |
520 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
950mV |
Power Supplies |
0.95V |
Number of I/O |
520 |
RAM Size |
2.6MB |
Number of Inputs |
520 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
530250 |
Total RAM Bits |
21606000 |
Number of LABs/CLBs |
30300 |
Speed Grade |
2 |
Number of Registers |
484800 |
Height Seated (Max) |
3.51mm |
Length |
35mm |
Width |
35mm |
RoHS Status |
ROHS3 Compliant |
XCKU040-2FFVA1156E Overview
There are two packages that contain fpga chips: 1156-BBGA, FCBGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. 520 I/Os are available for transferring data more efficiently. Logic elements/cells form the fundamental building block of a computer. It is powered from a supply voltage of 0.95V. FPGA parts like this belong to the Field Programmable Gate Arrays family. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.922V~0.979V. FPGAs belonging to the Kintex? UltraScale? series are a type of FPGA that belong to the Kintex? UltraScale? series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. With this device, you will be able to make use of 520 outputs. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. This device is equipped with 21606000 RAM bits in terms of its RAM si21606000e. For the program to work properly, the RAM si2.6MBe of this FPGA module must reach 2.6MB GB in order to ensure normal operation. 30300 LABs/CLBs are integrated into this FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 950mV supply voltage, designers can take full advantage of its flexibility. Powered by a 0.95V power supply, it can be operated by almost anyone. The registers used in the transfer of and storage of data are 484800 in number.
XCKU040-2FFVA1156E Features
520 I/Os
Up to 21606000 RAM bits
484800 registers
XCKU040-2FFVA1156E Applications
There are a lot of Xilinx Inc. XCKU040-2FFVA1156E FPGAs applications.
- Automotive driver's assistance
- Automotive Applications
- Broadcast
- Consumer Electronics
- ASIC prototyping
- Integrating multiple SPLDs
- Automotive
- Military Temperature
- Random logic
- Scientific Instruments