XCKU060-3FFVA1156E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 1156-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Bulk |
| Published | 2012 |
| Series | Kintex® UltraScale™ |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Packing Method | TRAY |
| Technology | CMOS |
| Voltage - Supply | 0.970V~1.030V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B1156 |
| Number of Outputs | 520 |
| Qualification Status | Not Qualified |
| Power Supplies | 1V |
| Number of I/O | 520 |
| RAM Size | 4.8MB |
| Memory Type | RAM |
| Number of Inputs | 520 |
| Organization | 2760 CLBS |
| Number of Logic Elements/Cells | 725550 |
| Total RAM Bits | 38912000 |
| Number of LABs/CLBs | 41460 |
| Speed Grade | 3 |
| Number of CLBs | 2760 |
| Max Junction Temperature (Tj) | 100°C |
| Height | 3.51mm |
| RoHS Status | ROHS3 Compliant |
XCKU060-3FFVA1156E Overview
As part of the 1156-BBGA, FCBGA package, it is included. The device has 520 I/O ports for more coherent data transfer. A fundamental building block is made up of 725550 logic elements/cells. Power is provided by a 1V-volt supply. FPGA modules can be attached to development boards using a Surface Mount-connector. In order to operate it, it requires a voltage supply of 0.970V~1.030V . It is a type of FPGA that belongs to the Kintex? UltraScale? series of FPGAs. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. In this device, there are 520 outputs that can be used. It is for space saving reasons that this FPGA model is contained in Bulk. Having a RAM bit size of 38912000 means that this device will offer you a lot of memory. It is crucial that the RAM si4.8MBe of this FPGA module reaches 4.8MB so that the program can run normally. The FPGA is built as an array of 41460 latches or CLBs. Fpga electronics operates from a 1V power supply. In its architecture, there are 2760 CLB modules. Data is stored in the RAM memory, so resource conflicts are avoided. Due to most industry design purposes, fpga circuit adapts the packing method TRAY.
XCKU060-3FFVA1156E Features
520 I/Os
Up to 38912000 RAM bits
XCKU060-3FFVA1156E Applications
There are a lot of Xilinx Inc. XCKU060-3FFVA1156E FPGAs applications.
- Defense Applications
- Distributed Monetary Systems
- Computer hardware emulation
- Image processing
- Data center hardware accelerators
- OpenCL
- Software-defined radio
- Medical imaging
- High Performance Computing
- Artificial intelligence (AI)
