Parameters |
Mount |
Surface Mount |
Package / Case |
FBGA |
Number of Pins |
324 |
Packaging |
Bulk |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Moisture Sensitivity Level (MSL) |
3 |
Number of Terminations |
324 |
ECCN Code |
3A991.D |
Terminal Finish |
Tin/Lead (Sn63Pb37) |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Additional Feature |
YES |
HTS Code |
8542.39.00.01 |
Subcategory |
Programmable Logic Devices |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
225 |
Supply Voltage |
3.3V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
324 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
3.3V |
Supply Voltage-Max (Vsup) |
3.6V |
Temperature Grade |
COMMERCIAL |
Number of I/O |
220 |
Memory Type |
EEPROM |
Propagation Delay |
12 ns |
Frequency (Max) |
83MHz |
Programmable Logic Type |
EE PLD |
Number of Gates |
9000 |
Number of Logic Blocks (LABs) |
24 |
Speed Grade |
12 |
Output Function |
MACROCELL |
Number of Macro Cells |
384 |
JTAG BST |
YES |
In-System Programmable |
YES |
Height Seated (Max) |
2.5mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
Non-RoHS Compliant |
Lead Free |
Contains Lead |
XCR3384XL-12FG324C Overview
There are 384 macro cells, which provide radio coverage via high-power cell towers, antennas or masts in a mobile phone network.A FBGA package contains the item.In this case, there are 220 I/Os programmed.It is programmed that device terminations will be 324 .There is a BOTTOMterminal position on the electrical part in question.A voltage of 3.3V is used as the power supply for this device.There is a part included in Programmable Logic Devices.Ideally, the chip should be packaged by Bulk.There are 324pins on the chip.If you use this device, you will also find [0].The 9000gates serve as building blocks for digital circuits.If high efficiency is desired, the supply voltage should be kept at [0].For data storage, EEPROMis adopted.Surface Mountis used to mount this electronic component.There are 324 pins on the device.In order to ensure proper operation, a maximum supply voltage (Vsup) of 3.6V is required.It is recommended that the operating temperature exceeds 0°C.It is recommended to keep the operating temperature below 70°C.In its simplest form, it consists of 24 logic blocks (LABs).It is recommended that the maximal frequency be lower than 83MHz.Programmable logic types are divided into EE PLD.
XCR3384XL-12FG324C Features
FBGA package
220 I/Os
324 pin count
324 pins
24 logic blocks (LABs)
XCR3384XL-12FG324C Applications
There are a lot of Xilinx XCR3384XL-12FG324C CPLDs applications.
- Network Interface Card (NIC) and Host Bus Adapter (HBA)
- Software-Driven Hardware Configuration
- Multiple Clock Source Selection
- Custom shift registers
- Handheld digital devices
- State machine control
- Digital designs
- Parity generators
- ANALOG-TO-DIGITAL CONVERTOR (ADC)
- Digital systems