XCV600-4BG432C
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 432-LBGA Exposed Pad, Metal |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2002 |
| Series | Virtex® |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 432 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 2.375V~2.625V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 2.5V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XCV600 |
| Pin Count | 432 |
| Number of Outputs | 316 |
| Operating Supply Voltage | 2.5V |
| Number of I/O | 316 |
| RAM Size | 12kB |
| Clock Frequency | 250MHz |
| Number of Inputs | 316 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 15552 |
| Total RAM Bits | 98304 |
| Number of Gates | 661111 |
| Number of LABs/CLBs | 3456 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.8 ns |
| Height Seated (Max) | 1.7mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XCV600-4BG432C Overview
In the 432-LBGA Exposed Pad, Metal package, you will find fpga chips. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. Its 316 I/Os help it transfer data more efficiently. A fundamental building block consists of 15552 logic elements/cells. In order for the device to operate, a supply voltage of 2.5V volts needs to be provided. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. FPGA modules can be attached to development boards using a Surface Mount-connector. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~2.625V. This is a type of FPGA that is part of the Virtex? series of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. A device such as this one has 316 outputs built into it. There is an FPGA model contained in Tray in order to conserve space. In total, it has a total of 432 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 98304 bFpga chipss. Its base part number XCV600 can be used to find related parts. The FPGA module's RAM si12kBe reaches 12kB in order to ensure that the program operates in a normal manner. An array of 3456 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. When operating with the supply voltage of 2.5V, designers can fully make use of its flexibility. Fpga semiconductor is made up of 661111 gates as fpga semiconductors basic building block. There are a total of 432 pins on this device. A crystal oscillating at 250MHz is one of the most common components of this device.
XCV600-4BG432C Features
316 I/Os
Up to 98304 RAM bits
XCV600-4BG432C Applications
There are a lot of Xilinx Inc. XCV600-4BG432C FPGAs applications.
- Data Center
- Automotive
- Software-defined radio
- Telecommunication
- Image processing
- Consumer Electronics
- Automotive advanced driver assistance systems (ADAS)
- Filtering and communication encoding
- Computer hardware emulation
- Secure Communication
